Tja... Das Netz hilft da durchaus mal weiter...
Semiconductor Engineering .:. FinFET Rollout Slower Than Expected
Dort werden sogar nur Kosten um, oder unter $4800 angenommen.
Zitat:
"If that’s not enough, there is also a sizable jump in manufacturing costs. In a typical 11-metal level process, there are 52 mask steps at 28nm. With an 80% fab utilization rate at 28nm, the loaded manufacturing cost is about $3,500 per 300mm wafer, according to Gartner.
At 1.3 days per lithography layer, the cycle time for a 28nm chip is about 68 days. “Add one week minimum for package testing,” Wang said. “So, the total is two-and-half months from wafer start to chip delivery.”
At 16nm/14nm, there are 66 mask steps. With an 80% fab utilization rate at 16nm/14nm, the loaded cost is about $4,800 per 300mm wafer, according to Gartner. “It takes three months from wafer start to chip delivery,” he added."
Da siehst Du auch, dass es ungefähr 3 Monate dauert, einen Wafer komplett zu belichten und die Chips rauszutrennen - Siehe "mehrere Monate".
Edit: Ja, die $1000 Materialkosten waren aus der Hüfte geschossen, aber selbst bei einer Verzehnfachung kommt es kaum beim Endkunden an.